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| Product Overview |
|---|
The WC4DX Dell Heatsink Assembly is a dedicated cooling solution designed to fit the PowerEdge T430 server model. It effectively manages CPU heat by providing a reliable path for thermal dissipation, ensuring the server runs smoothly during demanding operations. This component is an integral part of the server's cooling system, helping to maintain stable temperatures and support overall system reliability. |
| General Information | |
|---|---|
| Brand | Dell |
| Part Number | WC4DX |
| Technical Specification | |
|---|---|
| Component Type | CPU Heatsink |
| Cooling Method | Passive |
| Material | Aluminum fins with copper heat pipes / copper base |
| Compatibility | Dell PowerEdge T430; compatible with Intel Xeon E5-2600 v3/v4 (LGA2011-v3) processors |
| Airflow Direction | Depends on chassis airflow (designed for front-to-rear chassis airflow) |
| Physical Characteristics | |
|---|---|
| Form Factor | Server CPU Heatsink Assembly |
| Weight | 5.00 |
| Condition | Refurbished |
| Miscellaneous | |
|---|---|
| Assembly Required | Yes |
| Eco Friendly | Yes |
| Compliance Standards | WEEE, RoHS, cURus, CE, FCC, CCC, UL, TUV, cULus, CSA, cUL |
| Product Description |
|---|
The WC4DX Heatsink Assembly is built to manage the thermal output of CPUs in Dell PowerEdge T430 servers. It plays a crucial role in maintaining system stability by effectively dispersing heat away from the processor. This component is commonly found in data centers and enterprise environments where server uptime and reliability are essential. Typically installed by IT professionals and system administrators, this heatsink supports consistent server operation under heavy workloads. Its design aligns with the specific cooling needs of the PowerEdge T430, helping prevent overheating and throttling during critical tasks. Key Features
This heatsink assembly is typically deployed in server racks within data centers, office server rooms, or any environment utilizing the PowerEdge T430 system. It helps maintain the server’s performance and longevity by preventing thermal issues that could cause downtime or hardware damage. |