Name: SH47A45774 Lenovo ThinkSystem HR860X V2 Rear CPU Heatsink
Brand: Lenovo
SKU: SH47A45774
Price: 82.80 USD
Availability: InStock
Rating: 4.8 (119 reviews)

Product Overview
The Lenovo ThinkSystem HR860X V2 Rear CPU Heatsink is designed to manage heat generated by processors in enterprise-grade servers. It fits into the rear CPU position of the HR860X V2 model, ensuring consistent cooling performance. This component is essential for maintaining system reliability in data centers and other environments where continuous high performance is expected.

General Information
Brand	Lenovo
Part Number	SH47A45774
Alternate Part Number	SH47A45774-13-CT

Technical Specification
Component Type	CPU Heatsink
Cooling Method	Passive
Compatibility	Lenovo ThinkSystem HR860X V2
Airflow Direction	Front to Back

Physical Characteristics
Form Factor	Rear
Weight	3.00
Condition	Refurbished

Miscellaneous
Assembly Required	Yes
Eco Friendly	Yes
Compliance Standards	WEEE, RoHS, cURus, CE, FCC, CCC, UL, TUV, cULus, CSA, cUL

Product Description
The Lenovo ThinkSystem HR860X V2 Rear CPU Heatsink plays a crucial role in maintaining optimal temperatures for processors in the HR860X V2 server. Commonly found in data center racks and enterprise server rooms, this heatsink helps ensure stable operation under heavy computational loads. Built for system integrators and IT professionals managing Lenovo ThinkSystem servers, it supports reliable thermal management, extending the lifespan of critical components. Its design fits the rear position in the server chassis, complementing other cooling elements for balanced airflow. Key Features Precision-engineered to fit the HR860X V2 server rear CPU socket Materials chosen for effective heat transfer and durability in continuous use Supports high airflow environments typical in enterprise data centers Helps maintain server performance by preventing thermal throttling Compatible with Lenovo's thermal management protocols and hardware This heatsink is typically deployed in dense server configurations where efficient cooling is essential. By managing heat effectively, it contributes to the overall system stability and reduces the risk of hardware failure during intensive processing tasks.

Use Cases
The Lenovo ThinkSystem HR860X V2 Rear CPU Heatsink is primarily deployed in enterprise data centers where server reliability and thermal management are critical. It is suited for IT infrastructure teams managing high-density server racks that run intensive workloads, such as virtualization and large-scale data processing. How It's Used: Cooling rear CPUs in Lenovo HR860X V2 servers within cloud service provider data centers handling multi-tenant environments. Supporting high-performance computing clusters in research institutions requiring continuous processing under heavy thermal loads. Maintaining optimal temperatures in enterprise virtualization environments to ensure stability during peak workload periods. Enhancing thermal management in storage clusters where sustained I/O operations generate significant heat. Facilitating efficient cooling in edge computing deployments that use compact Lenovo servers in space-constrained facilities. By effectively dissipating heat from the rear CPU, this heatsink contributes to maintaining system uptime and reducing thermal-related throttling. Its compatibility with specific Lenovo server models enables scalable deployments that meet the demands of evolving IT infrastructures.

SH47A45774 Lenovo ThinkSystem HR860X V2 Rear CPU Heatsink

Product Overview

General Information

Technical Specification

Physical Characteristics

Miscellaneous

Product Description

Use Cases