Name: M386B4G70DM0-YK03 Samsung 32GB PC3-12800 DDR3-1600MHz ECC Registered CL11 240-Pin LRDIMM Quad Rank Memory Module
Brand: Samsung
SKU: M386B4G70DM0-YK03
Price: 111.00 USD
Availability: InStock
Rating: 4.8 (119 reviews)

Product Overview
The Samsung M386B4G70DM0-YK03 is a high-capacity 32GB PC3-12800 DDR3-1600MHz memory module designed for enterprise servers. It features ECC for error correction, enhancing data integrity, and operates at a bus speed of 1600 MT/s, providing efficient performance. With a quad rank configuration (4Rx4) and a load-reduced DIMM design, it optimizes scalability and reliability in demanding applications. Operating at 1.35V, this 240-pin DIMM offers a memory bandwidth of 12.8 GB/s, making it a robust choice for high-performance server environments. Compliant with JEDEC and RoHS standards, it combines reliability with environmental responsibility.

General Information
Brand	Samsung
Part Number	M386B4G70DM0-YK03

Technical Information
Memory Capacity	32GB
Memory Technology	DDR3
Module Type	LRDIMM
RAM Standard	PC3-12800
Pin Count	240-Pin
Rank	4Rx4
Voltage	1.35V

Performance
Bus Speed	1600 MT/s
Bandwidth	12.8 GB/s
Native Speed	1600 MHz
CAS	CL11

Physical Characteristics
Package	FBGA
Dimensions	Standard DIMM dimensions
Weight	0.50
Condition	Refurbished

Miscellaneous
Eco Friendly	Yes
Compliance Standards	RoHS

Product Description
The Samsung M386B4G70DM0-YK03 is a high-capacity 32GB memory module designed for enterprise servers and applications that require reliable and efficient performance. Utilizing DDR3 SDRAM technology, this memory module adheres to the PC3-12800 standard, providing a bus speed of 1600 MT/s, ensuring quick data access and processing. This ECC (Error-Correcting Code) registered Load-Reduced DIMM (LRDIMM) features a quad rank configuration (4Rx4), enhancing data integrity by detecting and correcting memory errors. Operating at a voltage of 1.35V, this memory module is optimized for energy efficiency without compromising performance. With a 240-pin DIMM form factor, the M386B4G70DM0-YK03 is designed for compatibility with a variety of server motherboards. It offers a memory bandwidth of 12.8 GB/s, making it suitable for high-demand applications in virtualized environments and data centers. Compliant with JEDEC and RoHS standards, this memory module provides a reliable and environmentally friendly solution for enterprise storage needs. Key Features: Memory Capacity: 32GB for substantial data handling and application performance. Memory Technology: DDR3 SDRAM for efficient operation. RAM Genre: ECC Registered Load-Reduced DIMM (LRDIMM) for enhanced reliability. Memory Standard: PC3-12800 for compatibility with various systems. Bus Speed: 1600 MT/s for efficient data transfer. Number of Pins: 240-pin DIMM for broad compatibility. Rank: Quad Rank (4Rx4) for increased capacity and performance. CAS Latency: CL11 for responsive data access. Voltage: 1.35V, ensuring energy efficiency. Memory Bandwidth: 12.8 GB/s for high-speed performance. Error Correction: ECC for improved data integrity. Form Factor: 240-pin DIMM designed for server applications. The Samsung M386B4G70DM0-YK03 32GB DDR3 memory module is an ideal solution for organizations seeking to enhance their server performance and reliability, ensuring efficient operation in demanding environments.

Use Cases
The Samsung M386B4G70DM0-YK03 memory module is primarily utilized in high-density server configurations where error correction and data integrity are critical. It suits enterprise IT environments requiring scalable memory solutions for virtualization, databases, and large-scale computing workloads. How It's Used: Supporting virtualization hosts in data centers managing multiple virtual machines with high memory demands. Enhancing reliability and capacity in storage clusters performing intensive input/output operations. Enabling large-scale database servers to maintain data accuracy and system uptime in enterprise environments. Deploying in rack-mounted servers that require load-reduced DIMMs to optimize power consumption and thermal management. Utilized in financial services computing platforms where error correction is vital for transaction integrity. This memory module facilitates operational efficiency by delivering reliable performance under heavy workloads, while its load-reduced design supports greater memory density and scalability. It is well-suited to enterprise infrastructures demanding both robustness and flexibility in memory configuration.