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| Product Overview |
|---|
The ASRock Rack ROMED16QM3 motherboard is a feature-rich server solution designed for AMD EPYC™ processors. With robust memory support, PCIe 4.0 expansion options, and reliable networking, it is perfect for building high-performance servers that can handle demanding tasks. Its scalable design and advanced features ensure that it is equipped for both current and future server needs, making it a solid foundation for any enterprise-level computing infrastructure. |
| General Information | |
|---|---|
| Brand | ASRock |
| Part Number | ROMED16QM3 |
| Technical Information | |
|---|---|
| Chipset | AMD EPYC™ 7003 (with AMD 3D V-Cache™ Technology) / 7002 Series |
| Compatible Processors | AMD EPYC™ 7003 |
| Board Socket Type | Single Socket SP3 (LGA 4094) |
| Memory Slots | 16 DIMM slots (2DPC) |
| Memory Support | DDR4 RDIMM, LRDIMM, RDIMM/LRDIMM-3DS, NVDIMM-N |
| Storage Interfaces | 10 low-profile SlimSAS (PCIe4.0 x8), 2 low-profile SlimSAS (PCIe4.0 x8 or 8 SATA 6Gb/s) |
| Expansion Slots | 2 PCIe 4.0 x8 slots, 1 OCP NIC 3.0 (PCIe4.0 x16) |
| Physical Characteristics | |
|---|---|
| Form Factor | EEB |
| Dimensions | 12" x 13" |
| Weight | 5.00 |
| Condition | Refurbished |
| Product Description |
|---|
The ROMED16QM3 ASRock Rack Server Motherboard is a robust and high-performance motherboard designed to power server systems utilizing AMD EPYC 7003 and 7002 series processors with AMD's advanced 3D V-Cache technology. Featuring a single Socket SP3 (LGA 4094) for flexibility in processor choice, this motherboard supports up to 16 DIMM slots, which can accommodate DDR4 RDIMM, LRDIMM, and NVDIMM-N memory for superior memory capacity and performance. With PCIe 4.0 and SlimSAS interfaces, it offers ample connectivity options for high-speed storage and additional expansion. Key Features
The ROMED16QM3 motherboard is built for high-demand server environments, offering exceptional scalability and memory support. It provides all the essential components for creating a powerful server, ideal for handling complex workloads, large-scale data processing, and high-performance applications. |