P56435-B21

The P56435-B21 HPE 256GB DDR4-3200 Octal Rank x4 CAS-26-22-22 Load-Reduced 3DS Memory module is designed to provide high-capacity, high-speed memory solutions for enterprise servers and data centers. This advanced memory module leverages load-reduced DIMM technology to optimize signal integrity and reduce electrical load on the memory controller.

Typically found in HPE ProLiant servers and other enterprise-class systems, this memory module supports demanding workloads that require large memory footprints and reliable performance. IT professionals and system administrators benefit from using this module to improve system responsiveness and handle memory-intensive applications.

Key Features

• 256GB capacity for large-scale memory requirements
• DDR4-3200 MHz speed for fast data access
• Octal Rank x4 structure for enhanced memory density
• CAS latency timings of 26-22-22 for balanced performance
• Load-Reduced DIMM (LRDIMM) with 3DS stacking technology

This memory module is engineered to meet the rigorous demands of modern server environments, enabling efficient scaling and reliability. It supports optimized data throughput and minimizes latency to sustain high-performance computing tasks. Its robust design ensures stability under heavy workloads, making it a critical component for enterprise memory solutions.