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Product Overview |
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The HPE P39066-001 EPYC 75F3 processor brings powerful multi-core performance designed for enterprise servers and data centers. It fits into demanding environments where high core counts and reliable processing are essential for managing large-scale applications and virtualized workloads. |
General Information |
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| Brand | AMD |
| Part Number | P39066-001 |
Technical Information |
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| Processor Family | EPYC Milan |
| # Of Cores | 32 Core |
| Total Threads | 64 |
| Max Turbo Frequency | 4.0 GHz |
| Base Clock Speed | 2.95 GHz |
| PCIe Version | PCIe 4.0 |
| Lithography | 7 nm |
| Socket Type | SP3 |
| Cache | 256 MB |
| Thermal Design Power | 280 W |
Memory Specifications |
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| Max Memory Size | 4 TB |
| Memory Types | DDR4 |
| Max Memory Channels | 8 |
| Bandwidth | 204.8 GB/s |
Physical Characteristics |
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| Weight | 5.00 |
| Condition | Refurbished |
Product Description |
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This AMD EPYC 75F3 processor offers robust computing power with 32 cores and a base clock speed of 2.95GHz, making it well-suited for heavy-duty server environments. It is built for high throughput and parallel processing tasks, often found in enterprise data centers and cloud infrastructure setups. System administrators and IT professionals who manage virtualization, large databases, or compute-intensive applications often rely on this processor to ensure smooth and efficient operations. Key Features
This processor is typically deployed in high-density server racks where reliability and performance are critical. Its capabilities help organizations handle complex computations and virtual machines without compromising speed or stability. |
Use Cases |
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The AMD EPYC 75F3 processor is optimized for enterprise and data center environments requiring robust multi-core performance and thermal capacity. Organizations running complex virtualization setups or high-throughput analytics workloads will find this processor well-suited to meet their computing demands efficiently. How It's Used:
This processor helps maintain operational efficiency by delivering scalable compute power under demanding loads. Its design supports dense rack deployments while managing thermal output, ensuring sustained performance for mission-critical applications. |