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| Product Overview |
|---|
The HP High Performance Heatsink for ProLiant DL325 Gen10 Plus keeps the server's AMD EPYC processor cool by efficiently managing heat. It fits directly on the processor socket and is designed to handle the thermal demands of high-performance workloads in data centers or enterprise servers. This component is essential for maintaining stable operation and preventing overheating in demanding computing environments. |
| General Information | |
|---|---|
| Brand | HPE |
| Part Number | P22766-001 |
| Technical Specification | |
|---|---|
| Component Type | CPU Heatsink |
| Cooling Method | Passive |
| Material | Copper base, Aluminum fins |
| Compatibility | HP ProLiant DL325 Gen10 Plus (AMD EPYC) |
| Airflow Direction | Front-to-back |
| Physical Characteristics | |
|---|---|
| Weight | 5.00 |
| Condition | Refurbished |
| Miscellaneous | |
|---|---|
| Assembly Required | Yes |
| Eco Friendly | Yes |
| Compliance Standards | WEEE, RoHS, CE |
| Product Description |
|---|
This HP High Performance Heatsink is designed to provide reliable cooling for the ProLiant DL325 Gen10 Plus server. It helps maintain optimal operating temperatures for the server's AMD EPYC processors, which are commonly found in data centers and enterprise environments requiring robust processing power. Built for IT professionals and system administrators, this heatsink supports enhanced thermal management to prevent overheating during intensive computational tasks. Its design prioritizes efficiency and compatibility, making it a critical component in maintaining server uptime and performance. Key Features
This heatsink is often deployed in enterprise data centers, cloud infrastructure setups, and virtualized computing environments. It plays a vital role in keeping server components within safe temperature ranges, ensuring consistent processing power and system reliability over time. |