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Product Overview |
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The HP High Performance Heatsink Kit for ProLiant DL38X G10 Plus is created to manage processor heat in high-density server environments. It fits directly into the server architecture to provide reliable cooling, helping maintain system stability and performance during complex workloads. |
General Information |
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| Brand | HPE |
| Part Number | P14610-B21 |
Technical Specification |
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| Component Type | CPU Heatsink |
| Cooling Method | Passive |
| Material | Copper base with aluminum fins |
| Compatibility | HPE ProLiant DL38x Gen10 Plus (P14610-B21) |
| Airflow Direction | Front-to-Back |
Physical Characteristics |
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| Form Factor | Server CPU heatsink (kit) |
| Weight | 5.00 |
| Condition | Refurbished |
Miscellaneous |
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| Assembly Required | Yes |
| Eco Friendly | Yes |
| Compliance Standards | RoHS |
Product Description |
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This heatsink kit is built for effective heat dissipation in HP ProLiant DL38X G10 Plus servers, helping maintain stable CPU temperatures under heavy workloads. It's commonly used in data centers and enterprise environments where consistent server performance is critical. System administrators and IT professionals rely on this component to ensure server reliability and prevent overheating issues in multi-processor setups. Key Features
This heatsink kit is typically installed in enterprise servers running demanding applications, where effective cooling extends hardware life and reduces downtime. It plays a crucial role in keeping server performance steady even under peak usage. |
Use Cases |
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The HP High Performance Heatsink Kit for ProLiant DL38X G10 Plus is typically deployed in high-density server racks where efficient thermal management is critical. IT administrators managing enterprise data centers or cloud infrastructure benefit most from this solution as it ensures processor stability under intense workloads and multi-processor configurations. How It's Used:
This heatsink kit enhances operational efficiency by providing targeted thermal management that sustains CPU performance and prolongs hardware lifespan. It supports scalability in complex server environments by ensuring that thermal constraints do not limit workload execution or hardware deployment density. |