P11448-ZA1

The P11448-ZA1 HPE 256GB DDR4-3200 Octal Rank x4 CAS-26-22-22 Load-Reduced 3DS Memory is engineered to provide high-density memory solutions for enterprise servers. This module uses advanced 3D Stacked (3DS) technology to deliver increased capacity while maintaining efficient power consumption and thermal performance.

Typically found in HPE servers requiring large memory pools, this Load-Reduced DIMM (LRDIMM) is ideal for data centers and cloud computing environments where reliability and scalability are critical. IT administrators and system architects benefit from its high capacity and speed, enhancing overall server performance.

Key Features

• 256GB capacity with octal rank x4 organization
• DDR4-3200 MHz speed for fast data access
• CAS latency timings of 26-22-22
• Load-Reduced DIMM design for improved signal integrity and power efficiency
• 3D Stacked (3DS) memory technology for high-density modules

This memory module supports intensive workloads such as virtualization, large databases, and in-memory analytics. Its robust design ensures stability and performance in demanding server environments, making it a reliable choice for expanding memory infrastructure.