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Product Overview |
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The Samsung M471B5773CHS-CH9 is a 2GB DDR3 SO-DIMM memory module operating at 1333 MHz with CAS latency 9. It features a non-ECC design, making it suited for laptops and small form factor computers that do not require error correction. This module supports standard DDR3 protocols and comes in a 204-pin SO-DIMM format. |
General Information |
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| Brand | Samsung |
Technical Information |
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| Memory Capacity | 2GB |
| Memory Technology | DDR3 |
| Module Type | SO-DIMM |
| RAM Standard | PC3-10600 |
| Pin Count | 204-Pin |
| Error Correction | Non-ECC |
| Rank | 1Rx8 |
| Voltage | 1.5V |
Performance |
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| Bus Speed | 1333 MT/s |
| Bandwidth | 10600 MB/s |
| Native Speed | 1333 MHz |
| CAS | CL9 |
Physical Characteristics |
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| Package | FBGA |
| Dimensions | 67.6mm x 30mm x 3.04mm |
| Weight | 3.00 |
| Condition | Refurbished |
Miscellaneous |
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| Eco Friendly | Yes |
| Compliance Standards | RoHS, CE, FCC |
| Assembly Required | No |
Product Description |
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The Samsung M471B5773CHS-CH9 is a 2GB DDR3 SO-DIMM memory module designed for use in compatible laptops and small form factor systems. It operates at 1333 MHz with a CAS latency of 9, making it suitable for general computing tasks and everyday workloads. This memory module is non-ECC, meaning it does not have error-correcting code and is intended for consumer or mobile devices where ECC is not required. Its compact SO-DIMM form factor fits into limited space environments typically found in laptops. Key Features
This module provides an effective memory upgrade option for compatible laptops seeking to maintain or improve standard memory capacity. It supports standard DDR3 memory protocols and fits in devices requiring 204-pin SO-DIMM modules. Its specifications align with typical mid-range laptop memory needs. |
Use Cases |
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The Samsung M471B5773CHS-CH9 memory module is typically used in laptop computers and compact systems that require DDR3 SO-DIMM memory. It is appropriate for environments where standard memory without ECC is sufficient for everyday computing tasks. How It's Used:
This module serves the operational need for DDR3 memory in devices that do not require ECC, providing standard memory support in mobile and small form factor computing environments. |
FAQ's |
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