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Product Overview |
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The HP 4GB DDR4 2666MHz CL19 Non-ECC SODIMM Memory module provides 4GB of DDR4 RAM operating at 2666MHz with a CAS latency of 19. It is a Non-ECC SODIMM designed primarily for laptops and small form factor systems where standard memory without error correction is used. |
General Information |
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| Brand | HP |
Technical Information |
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| Memory Capacity | 4GB |
| Memory Technology | DDR4 |
| Module Type | SO-DIMM |
| RAM Standard | PC4-21300 |
| Pin Count | 260-Pin |
| Error Correction | Non-ECC |
| Rank | Single Rank (1Rx8) |
| Voltage | 1.2V |
Performance |
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| Bus Speed | 2666 MT/s |
| Bandwidth | 21300 MB/s |
| Native Speed | 2666 MT/s |
| CAS | CL19 |
Physical Characteristics |
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| Package | FBGA |
| Dimensions | 30 x 69.6 x 3 mm |
| Weight | 3.00 |
| Condition | Refurbished |
Miscellaneous |
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| Eco Friendly | Yes |
| Compliance Standards | WEEE, RoHS, CE |
| Assembly Required | No |
Product Description |
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The HP 4GB DDR4 2666MHz CL19 Non-ECC SODIMM Memory module provides essential memory capacity and speed for compatible computing devices. Commonly used in laptops and small form factor systems, this module supports standard DDR4 architecture delivering stable operation at 2666MHz. IT professionals and system builders select this memory module to upgrade or replace existing RAM in environments where 4GB capacity and non-ECC memory are adequate. Key Features
This memory module plays a practical role in enhancing system responsiveness where 4GB is sufficient for the workload. Its compatibility with DDR4 SODIMM slots ensures straightforward installation in supported devices. |
Use Cases |
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This HP 4GB DDR4 2666MHz CL19 Non-ECC SODIMM Memory is typically used to upgrade or replace RAM in laptops and compact devices requiring DDR4 memory. It supports general office and everyday computing tasks where moderate memory capacity suffices. How It's Used:
The module's role is to maintain or improve system memory capacity and operate within the specification limits of supported devices. It allows users to match system requirements without exceeding design parameters. |
FAQ's |
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