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Product Overview |
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The IBM 00D4966 is a 16GB DDR3 ECC Registered DIMM designed for server use, operating at 1333MHz with CL9 latency. It supports error correction for data reliability and features a very low profile form factor to fit compact server environments. |
General Information |
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| Brand | IBM |
Technical Information |
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| Memory Capacity | 16GB |
| Memory Technology | DDR3 SDRAM |
| Module Type | RDIMM |
| RAM Standard | PC3-10600 |
| Pin Count | 240-Pin |
| Error Correction | ECC |
| Voltage | 1.5V |
Performance |
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| Bus Speed | 1333MHz |
| Bandwidth | 10600 MB/s |
| Native Speed | 1333MT/s |
| CAS | CL9 |
Physical Characteristics |
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| Package | FBGA |
| Weight | 3.00 |
| Condition | Refurbished |
Miscellaneous |
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| Eco Friendly | Yes |
| Compliance Standards | RoHS, CE |
| Assembly Required | No |
Product Description |
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The IBM 00D4966 is a 16GB DDR3 RDIMM memory module designed to provide additional memory capacity for compatible IBM servers. It operates at a frequency of 1333MHz with CAS Latency 9, supporting ECC to detect and correct common types of internal data corruption. This memory module is tailored for use in enterprise server environments where stability and data integrity are critical. Its very low profile (VLP) design allows for efficient use of space within server chassis that support this form factor. Key Features
This memory module is intended to enhance server performance by increasing available memory while maintaining data reliability through ECC. Its VLP design makes it suitable for server models where physical space constraints exist, allowing for flexible hardware configuration. |
Use Cases |
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This 16GB DDR3 ECC RDIMM memory module is typically used in IBM server systems requiring moderate to large memory capacity with error correction capabilities. It is suited for data centers and enterprise environments where maintaining data integrity and efficient use of chassis space are priorities. How It's Used:
In operation, this memory module contributes to stable server performance by offering expanded memory resources while ensuring data integrity. Its form factor allows integration into systems where chassis height may be limited. |
FAQ's |
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