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| Product Overview |
|---|
The BXSTS100C Intel Thermal Solution is a combined active and passive cooler designed for Intel LGA1366 socket processors. It manages heat from CPUs with up to 130 watts of thermal power, balancing quiet operation with effective cooling. This solution fits well in both desktop and server systems where maintaining steady temperatures is critical during extended periods of use. |
| General Information | |
|---|---|
| Brand | Intel |
| Part Number | BXSTS100C |
| Technical Specification | |
|---|---|
| Component Type | CPU Heatsink |
| Cooling Method | Active |
| Material | Aluminum fins with copper heat pipes and copper base |
| Compatibility | Intel Socket LGA1366 (Socket B); supports up to 130W CPU TDP (Intel Core i7 Nehalem/Westmere series) |
| Voltage | 12V |
| Connector Type | 4-pin PWM |
| Airflow Direction | Push (downward onto CPU) |
| Physical Characteristics | |
|---|---|
| Weight | 3.00 |
| Condition | Refurbished |
| Miscellaneous | |
|---|---|
| Assembly Required | Yes |
| Eco Friendly | Yes |
| Compliance Standards | RoHS, CE |
| Product Description |
|---|
The BXSTS100C is a thermal solution designed to manage heat dissipation for Intel processors using the LGA1366 socket. It combines active and passive cooling methods to provide effective temperature control for CPUs with thermal design power up to 130 watts. Often found in workstations and server environments, this cooler supports stable operation during intensive tasks such as data processing and content creation. It is built for users who need reliable thermal management without adding excessive noise or complexity. Key Features
This cooler is typically deployed in systems requiring consistent thermal performance to avoid overheating. It plays a vital role in maintaining processor stability and longevity in demanding computing environments. |