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BXSTS100C Intel Thermal Solution Active/Passive ComboHeat up to 130-Watt CPU TDP Socket LGA1366

SKU:

BXSTS100C

Weight: 3.00 lbs
Condition: Refurbished
  • Active/passive combo cooling for Intel LGA1366 CPUs
  • Efficient thermal solution for processors up to 130W TDP
  • Compatible with high-performance desktop and server setups
  • Designed to maintain optimal CPU temperatures under heavy load
In stock

$59.00
Product Overview

The BXSTS100C Intel Thermal Solution is a combined active and passive cooler designed for Intel LGA1366 socket processors. It manages heat from CPUs with up to 130 watts of thermal power, balancing quiet operation with effective cooling. This solution fits well in both desktop and server systems where maintaining steady temperatures is critical during extended periods of use.

General Information
Brand Intel
Part Number BXSTS100C
Technical Specification
Component Type CPU Heatsink
Cooling Method Active
Material Aluminum fins with copper heat pipes and copper base
Compatibility Intel Socket LGA1366 (Socket B); supports up to 130W CPU TDP (Intel Core i7 Nehalem/Westmere series)
Voltage 12V
Connector Type 4-pin PWM
Airflow Direction Push (downward onto CPU)
Physical Characteristics
Weight 3.00
Condition Refurbished
Miscellaneous
Assembly Required Yes
Eco Friendly Yes
Compliance Standards RoHS, CE


Product Description

The BXSTS100C is a thermal solution designed to manage heat dissipation for Intel processors using the LGA1366 socket. It combines active and passive cooling methods to provide effective temperature control for CPUs with thermal design power up to 130 watts.

Often found in workstations and server environments, this cooler supports stable operation during intensive tasks such as data processing and content creation. It is built for users who need reliable thermal management without adding excessive noise or complexity.

Key Features

  • Hybrid cooling approach using both fan-driven airflow and heat sink surface area
  • Compatible with a range of Intel LGA1366 CPUs up to 130W TDP
  • Optimized for quiet operation under high workloads
  • Easy installation tailored for standard desktop and server motherboards
  • Durable materials ensuring long-term reliability

This cooler is typically deployed in systems requiring consistent thermal performance to avoid overheating. It plays a vital role in maintaining processor stability and longevity in demanding computing environments.


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BXSTS100C Intel Thermal Solution Active/Passive ComboHeat up to 130-Watt CPU TDP Socket LGA1366
BXSTS100C Intel Thermal Solution Active/Passive ComboHeat up to 130-Watt CPU TDP Socket LGA1366
$59.00