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| Product Overview |
|---|
The IBM Enhanced Cooling Module for BladeCenter H 8852 helps maintain stable operating temperatures by improving airflow within the chassis. It fits into existing setups where efficient heat management is crucial for server reliability and performance, especially in dense blade server arrangements. |
| General Information | |
|---|---|
| Brand | IBM |
| Part Number | 68Y8202 |
| Technical Specification | |
|---|---|
| Component Type | Fan Tray |
| Cooling Method | Active |
| Compatibility | IBM BladeCenter H (8852) |
| Physical Characteristics | |
|---|---|
| Form Factor | BladeCenter H Fan Tray (Hot-swap) |
| Weight | 3.00 |
| Condition | Refurbished |
| Miscellaneous | |
|---|---|
| Assembly Required | Yes |
| Eco Friendly | Yes |
| Compliance Standards | WEEE, RoHS, cURus, CE, FCC, CCC, UL, TUV, cULus, CSA, cUL |
| Product Description |
|---|
The IBM Enhanced Cooling Module is built to support the BladeCenter H 8852 chassis by improving internal airflow and heat dissipation. It's commonly used in data centers where blade servers generate substantial heat and need consistent cooling to maintain performance and hardware longevity. Often found in enterprise IT setups, this module benefits administrators and engineers responsible for maintaining system stability under heavy workloads. Its integration helps sustain operational efficiency and prevent overheating in tightly packed server configurations. Key Features
Typically deployed within IBM blade server environments, this cooling module plays a key role in managing temperature-sensitive equipment. It helps IT teams avoid thermal-related failures, making it a practical choice for demanding data center conditions. |