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Product Overview |
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The Intel Heatsink and Fan Assembly (C33218-002) is an excellent solution for keeping your processor cool. With a compact 2.5-inch fan and efficient heat dissipation capabilities through the aluminum heatsink with copper core, it delivers superior cooling performance. Perfect for systems that require stable and consistent operation, this assembly helps prevent overheating and ensures system stability during intensive tasks. |
General Information |
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| Brand | Intel |
| Part Number | C33218-002 |
| Product Type | Cooling Heatsink |
Technical Specification |
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| Voltage | 12V DC |
Physical Characteristics |
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| Weight | 3.00 |
| Condition | Refurbished |
Product Description |
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The Intel Heatsink and Fan Assembly (Part Number: C33218-002) is designed to provide effective cooling solutions for processors. Featuring a 2.5-inch fan with a 3-pin connector, this assembly ensures compatibility with a wide range of systems. The 12V DC voltage and 0.44A current offer stable and reliable operation, providing consistent airflow to keep your components cool. The aluminum heatsink combined with a copper core enhances heat dissipation, preventing overheating and maintaining system performance during heavy workloads. This assembly is a great option for systems requiring reliable and efficient cooling. Key Features
This heatsink and fan assembly ensures optimal cooling performance, maintaining component longevity and preventing thermal damage. |
Use Cases |
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The Intel DC12V .44A Heatsink and Fan Assembly is primarily used within compact server environments and specialized computing systems where space constraints demand efficient thermal management solutions. It is especially suitable for IT professionals managing virtualization platforms or edge computing nodes requiring reliable cooling to maintain consistent processing speeds. How It's Used:
This fan and heatsink assembly facilitates stable processor operation by effectively dissipating heat in space-limited and high-demand IT infrastructures. Its integration supports operational continuity and enables scalability by reducing thermal-related downtime risks in critical deployments. |