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Product Overview |
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The HP 8GB DDR4-2666MHz PC4-21300 Non-ECC Unbuffered SODIMM is a memory upgrade designed primarily for laptops and small desktops. It provides fast, reliable memory capacity that fits into compact spaces, improving overall system performance without requiring additional power or complex setup. |
General Information |
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| Brand | HP |
| Part Number | 932817-H76 |
Technical Information |
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| Memory Capacity | 8GB |
| Memory Technology | DDR4 |
| RAM Standard | PC4-21300 |
| Pin Count | 260-Pin |
| Error Correction | Non-ECC |
| Rank | 1Rx8 |
| Voltage | 1.2V |
Performance |
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| Bus Speed | 2666MHz |
| Bandwidth | 21300 MB/s |
| Native Speed | 2666MHz |
| CAS | 19 |
Physical Characteristics |
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| Weight | 0.50 |
| Condition | Refurbished |
Product Description |
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This 8GB DDR4-2666MHz memory module upgrades your laptop's performance by improving multitasking and responsiveness. It's commonly used in notebooks and small form-factor PCs that require reliable and efficient memory with low power draw. Users like IT professionals, students, and casual users benefit from smoother operation when running multiple applications or handling large files. Key Features
This module is often found in everyday laptops used for work, study, or entertainment, providing a noticeable boost in system responsiveness. Its compatibility and power efficiency make it a practical choice for extending the life of an existing machine or assembling a new one without complex configuration. |
Use Cases |
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The HP 8GB DDR4-2666MHz PC4-21300 Non-ECC Unbuffered SODIMM is optimized for enhancing the memory capacity of laptop systems and compact computing devices often used in business and technical environments. It is particularly suitable for users requiring efficient multitasking and reliable performance in space-constrained hardware configurations. How It's Used:
This memory module contributes to operational continuity and responsiveness within constrained hardware environments. Its compatibility with modern notebook architectures allows IT teams to scale device capabilities effectively while maintaining power and thermal efficiency critical to mobile and compact computing scenarios. |