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| Product Overview |
|---|
The IBM Compute Node Heatsink for Flex System X240 is designed to cool the processor effectively within the IBM Flex System infrastructure. It fits directly onto the compute node, helping to manage heat generated during intensive computing tasks and ensuring system components remain within safe temperature limits. |
| General Information | |
|---|---|
| Brand | IBM |
| Part Number | 81Y5127 |
| Technical Specification | |
|---|---|
| Component Type | CPU Heatsink |
| Cooling Method | Passive |
| Size | Single-CPU (fits Flex System x240 compute node CPU position) |
| Material | Copper base with aluminum fins |
| Compatibility | IBM Flex System x240 Compute Node (part number 81Y5127) |
| Airflow Direction | Front-to-Back |
| Physical Characteristics | |
|---|---|
| Form Factor | Server / Compute Node Heatsink |
| Condition | Refurbished |
| Miscellaneous | |
|---|---|
| Assembly Required | Yes |
| Eco Friendly | Yes |
| Compliance Standards | WEEE, RoHS |
| Product Description |
|---|
This IBM Compute Node Heatsink is built for managing the thermal output of the Flex System X240 compute node. It plays a crucial role in dissipating heat generated by the processor, ensuring the system runs within safe temperature ranges. Often found in data centers and enterprise environments, this heatsink supports the continuous operation of the Flex System X240 by preventing thermal throttling and hardware damage. IT professionals and system administrators rely on components like this to maintain server stability and performance. Key Features
This heatsink is typically installed within IBM Flex System chassis environments where efficient thermal management is essential. By maintaining the proper operating temperature, it helps prolong the lifespan of the compute node and supports consistent workload processing. |