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| Product Overview |
|---|
The IBM Rear Heatsink for System X240 compute node is a key component focused on managing heat at the back of the server unit. It fits directly into the design of the X240, ensuring proper cooling and supporting the hardware’s ability to handle continuous workloads effectively. |
| General Information | |
|---|---|
| Brand | IBM |
| Part Number | 81Y4332 |
| Alternate Part Number | 81Y4332-02-CT |
| Technical Specification | |
|---|---|
| Component Type | CPU Heatsink |
| Cooling Method | Passive |
| Compatibility | IBM System x240 Compute Node (81Y4332) |
| Physical Characteristics | |
|---|---|
| Form Factor | Rear Heatsink |
| Weight | 3.00 |
| Condition | Refurbished |
| Miscellaneous | |
|---|---|
| Assembly Required | Yes |
| Eco Friendly | Yes |
| Compliance Standards | WEEE, RoHS, cURus, CE, FCC, CCC, UL, TUV, cULus, CSA, cUL |
| Product Description |
|---|
This IBM Rear Heatsink is built specifically for the System X240 compute node, helping to dissipate heat effectively from the rear components. It plays a crucial role in maintaining system stability by managing temperature during demanding computing tasks. Often found in data centers and enterprise server racks, this heatsink supports continuous operation and helps prevent overheating. IT professionals and system administrators rely on such components to keep servers running smoothly and efficiently. Key Features
Typically deployed in server environments that demand reliable cooling solutions, this heatsink contributes to the overall health of the hardware. It plays an important role in reducing downtime and maintaining consistent processing speeds. |
| Use Cases |
|---|
The 81Y4332 IBM Rear Heatsink is essential for maintaining optimal thermal conditions within the System X240 Compute Node in various data center and enterprise environments. How It's Used:
By effectively managing heat within the System X240, this rear heatsink helps ensure reliable server performance and reduces the risk of overheating-related hardware issues. |