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Product Overview |
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The HP 687515-H69 4GB DDR3-1600MHz SoDIMM memory module offers a reliable and energy-efficient solution for enhancing laptop and notebook performance. Its low voltage operation and single-rank configuration make it suitable for systems requiring efficient multitasking capabilities. Whether for everyday computing or more demanding applications, this memory module provides the necessary support for improved system responsiveness and stability. |
General Information |
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| Brand | HP |
| Part Number | 687515-H69 |
Technical Information |
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| Memory Technology | DDR3 |
| RAM Standard | PC3-12800 |
| Voltage | 1.35V |
Performance |
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| CAS | CL11 |
Physical Characteristics |
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| Package | FBGA |
| Weight | 0.50 |
| Condition | Refurbished |
Product Description |
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The HP 687515-H69 is a 4GB DDR3-1600MHz PC3-12800 SoDIMM memory module, designed to enhance the performance of compatible laptops and notebooks. With a 204-pin interface, this non-ECC unbuffered module ensures reliable data transmission and stability. Operating at a low voltage of 1.35V, it contributes to energy efficiency without compromising on speed. The single-rank x8 configuration allows for efficient data access, making it suitable for multitasking and demanding applications. Key Features
This memory module is an ideal choice for users seeking to upgrade their system's memory capacity and performance, ensuring smooth operation and responsiveness in various computing tasks. |
Use Cases |
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This 4GB DDR3-1600MHz SoDIMM module is primarily used in upgrading or maintaining laptops and compact computing devices that require low-voltage memory for efficient power consumption. It suits IT environments managing fleets of notebooks where consistent multitasking and system stability are critical. How It's Used:
By providing a balance of energy efficiency and performance, this memory module aids in maintaining system responsiveness and operational continuity across various laptop-dependent environments. Its compatibility with low-voltage platforms ensures better thermal management and extended device longevity in demanding workflows. |