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Product Overview |
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The 540-7690 - Sun Memory Mezzanine Baffle Assembly for Netra T5440 Server serves as a targeted cooling component within the system architecture, directing airflow efficiently around memory modules. It fits seamlessly into the server chassis, contributing to effective thermal management that helps maintain consistent performance without overheating. |
General Information |
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| Brand | Sun Microsystems |
Technical Information |
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| product type | Airflow baffle / mezzanine baffle assembly |
| Product Category | Server chassis / internal component (airflow baffle) |
| Compatibility | Sun/Oracle Netra T5440 Server |
Miscellaneous |
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| Assembly Required | No |
Physical Characteristics |
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| Form Factor | Mezzanine baffle assembly (internal server airflow baffle) |
| Weight | 3.00 |
| Condition | Refurbished |
Product Description |
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This memory mezzanine baffle assembly is built for the Sun Netra T5440 server to improve internal airflow around the memory modules, helping to maintain optimal operating temperatures. Often found within enterprise-grade servers, it supports effective cooling strategies essential for maintaining hardware stability. System administrators and data center operators benefit from its precise design, which contributes to the overall reliability of server operations by preventing heat buildup in critical memory areas. Key Features
By facilitating efficient heat dissipation, this baffle assembly plays a crucial role in protecting memory components from thermal stress. Its reliable performance assists in sustaining the server’s overall stability and longevity. |
Use Cases |
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This baffle assembly is generally used in enterprise data centers or server rooms where Sun Netra T5440 servers are deployed. It suits environments requiring dependable thermal control around densely packed memory resources to prevent potential overheating issues. How It's Used:
Implementing this baffle assembly supports operational stability by improving airflow management around sensitive memory parts, helping maintain system performance and reduce thermal-related failures in critical server deployments. |