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| Product Overview |
|---|
The Lenovo ThinkSystem V2 V3 1U 16-EDSFF Backplane is designed to house multiple EDSFF SSDs within Lenovo's V2 and V3 1U servers. It serves as a crucial component that connects drives to the system, ensuring efficient data transfer and power supply while supporting high-density storage solutions in space-constrained setups. |
| General Information | |
|---|---|
| Brand | Lenovo |
| Part Number | 02YE082 |
| Alternate Part Number | 02YE082-03-CT |
| Technical Information | |
|---|---|
| Compatibility | Lenovo ThinkSystem V2 and V3 1U servers supporting 16x EDSFF (E1.S) drives |
| Miscellaneous | |
|---|---|
| Assembly Required | Yes |
| Eco Friendly | Yes |
| Compliance Standards | WEEE, RoHS, cURus, CE, FCC, CCC, UL, TUV, cULus, CSA, cUL |
| Physical Characteristics | |
|---|---|
| Form Factor | 1U, EDSFF (E1.S) 16-bay |
| Weight | 3.00 |
| Condition | Refurbished |
| Product Description |
|---|
This 1U 16-EDSFF Backplane is built for Lenovo ThinkSystem V2 and V3 servers, allowing users to install and manage a large number of EDSFF SSDs efficiently. It acts as a connection hub between the drives and the server motherboard, facilitating communication and power distribution. Often found in data centers and enterprise environments, this backplane supports high-performance storage configurations where space and cooling are critical. IT administrators and system integrators benefit from its design, which helps maximize server storage density without compromising airflow. Key Features
Typically deployed in enterprise server racks, this backplane is essential for setups requiring dense storage and fast data access. Its design helps maintain system stability while scaling storage in compact server environments. |
| Use Cases |
|---|
The 02YE082 Lenovo ThinkSystem V2 V3 1U 16-EDSFF Backplane is designed for enterprise IT environments requiring high-density storage solutions in a compact form factor. How It's Used:
By utilizing this backplane, organizations can effectively maximize server storage density and performance while maintaining compatibility and reliability standards. |