Name: 01KP653 Lenovo 165W 3U 3x Heatpipes Performance HeatSink for ThinkSystem SR550 SR650 SR590
Brand: Lenovo
SKU: 01KP653
Price: 129.60 USD
Availability: InStock
Rating: 4.8 (119 reviews)

Product Overview
The Lenovo 165-watts 3U 3x Heatpipes Performance HeatSink is designed to provide effective cooling for ThinkSystem SR550, SR650, and SR590 servers. It fits within the 3U space and uses three heatpipes to manage heat produced by high-power CPUs, helping maintain system reliability without occupying excessive rack space.

General Information
Brand	Lenovo
Part Number	01KP653
Alternate Part Number	01KP653-12-CT

Technical Specification
Component Type	CPU Heatsink
Cooling Method	Passive
Material	Aluminum fins, Copper heatpipes
Compatibility	Lenovo ThinkSystem SR550, SR650, SR590
Airflow Direction	Front-to-Back

Physical Characteristics
Form Factor	3U
Condition	Refurbished

Miscellaneous
Assembly Required	Yes
Eco Friendly	Yes
Compliance Standards	WEEE, RoHS, cURus, CE, FCC, CCC, UL, TUV, cULus, CSA, cUL

Product Description
This 165-watt performance heat sink is built to cool demanding processors in Lenovo's ThinkSystem SR series servers. Its 3U size and three heatpipes offer effective heat dissipation, ensuring the CPU operates within safe temperatures during heavy workloads. Commonly used in data centers and enterprise environments, this heat sink is ideal for IT professionals managing server hardware who need reliable cooling solutions to maintain system stability. Key Features Triple heatpipe setup helps rapidly transfer heat away from the CPU Designed specifically to fit ThinkSystem SR550, SR650, and SR590 models Supports processors with thermal design power up to 165 watts Compact 3U size balances cooling performance and space efficiency Durable build ensures long-term operation under continuous server loads Typically deployed inside Lenovo rack servers, this heat sink plays a crucial role in keeping critical server components cool. Its efficient design helps prevent overheating, which can improve system longevity and reduce downtime in busy IT infrastructures.

Use Cases
The 01KP653 Lenovo 165W 3U 3x Heatpipes Performance HeatSink is primarily utilized in data centers and enterprise server rooms where Lenovo ThinkSystem SR550, SR650, and SR590 servers operate under intensive workloads. IT administrators and system integrators benefit from its efficient thermal management to maintain CPU performance in dense rack deployments and virtualization environments. How It's Used: Cooling high-performance CPUs in enterprise virtualization servers within data centers. Supporting storage clusters that require sustained thermal control for reliability during heavy I/O operations. Maintaining optimal operating temperatures in SMB network servers under continuous workload demands. Enhancing server longevity in remote office setups where physical space and cooling resources are limited. Facilitating edge computing deployments by providing efficient heat dissipation in compact rack units. This heat sink aids operational efficiency by ensuring thermal stability, which is critical for scaling server performance and minimizing downtime. Its 3U form factor and triple heatpipe design align with high-density rack configurations, enabling organizations to optimize server racks without compromising cooling effectiveness.

01KP653 Lenovo 165W 3U 3x Heatpipes Performance HeatSink for ThinkSystem SR550 SR650 SR590

Product Overview

General Information

Technical Specification

Physical Characteristics

Miscellaneous

Product Description

Use Cases