Name: 00KC911 IBM Low-T Case Heatsink for System X3550 M5
Brand: IBM
SKU: 00KC911
Price: 97.00 USD
Availability: InStock
Rating: 4.8 (119 reviews)

Product Overview
The IBM Low-T Case Heatsink for System X3550 M5 is a cooling component designed to manage processor heat within compact server cases. It fits neatly into the X3550 M5 chassis and helps maintain system stability by preventing CPU overheating during heavy use.

General Information
Brand	IBM
Part Number	00KC911
Alternate Part Number	00KC911-15-CT

Technical Specification
Component Type	CPU Heatsink
Cooling Method	Passive
Compatibility	IBM System x3550 M5
Airflow Direction	Front-to-Back

Physical Characteristics
Form Factor	Low-profile (1U)
Condition	Refurbished

Product Description
This heatsink is designed to provide effective thermal management for IBM System X3550 M5 servers. It helps dissipate heat generated by the CPU, ensuring stable performance during intensive computing tasks. Often found in enterprise data centers, this component is built for system administrators and IT professionals who maintain and optimize server hardware. Its low-profile design makes it suitable for cases where space is limited but reliable cooling remains essential. Key Features Maintains consistent CPU temperatures to prevent overheating Compact size allows installation in constrained server environments Durable construction for long-term reliability Specifically engineered for IBM System X3550 M5 compatibility Supports continuous operation under demanding workloads This heatsink is typically deployed inside rack-mounted servers in corporate or data center settings. It plays a crucial role in keeping hardware running smoothly, reducing the risk of thermal shutdowns or performance drops.

Use Cases
The IBM Low-T Case Heatsink for System X3550 M5 is primarily utilized in environments where server density and thermal management are critical. IT professionals managing compact rack deployments benefit from its low-profile design that ensures reliable CPU cooling without requiring additional chassis space. How It's Used: Maintaining stable operating temperatures in virtualization environments within medium-sized data centers. Supporting edge computing nodes where limited space demands efficient thermal solutions. Facilitating reliable performance in storage clusters that run intensive I/O workloads. Enabling sustained CPU cooling for SMB network servers under consistent high-demand processing. Optimizing cooling in remote office setups deploying System X3550 M5 hardware with constrained airflow. By integrating this heatsink, organizations can enhance server operational efficiency and maintain optimal processing speeds under load. Its compatibility with System X3550 M5 chassis ensures seamless scalability for evolving infrastructure demands.

00KC911 IBM Low-T Case Heatsink for System X3550 M5

Product Overview

General Information

Technical Specification

Physical Characteristics

Product Description

Use Cases